| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element which can be laminated in a good yield and is very excellent in peeling characteristics, laminating property, shelf stability and working property and to provide a method for producing a resist pattern and a method for producing a printed circuit board or a lead frame with the resist pattern. <P>SOLUTION: In the photosensitive element consisting of a supporting film (a), a photosensitive resin composition layer (b) and a protective film (c), the layer (b) contains (A) a binder polymer having a weight average molecular weight of 20,000-200,000, (B) a photopolymerizable compound in which the concentration of polymerizable ethylenically unsaturated groups is 0.12-0.26 mol per 100 g, in total, of the components (A) and (B), and (C) a photopolymerization initiator, and the number of fish eyes of ≥80 μm diameter contained in the protective film (c) is ≤5 per 1 m<SP>2</SP>. The element is laminated on a substrate for forming a circuit in such a way that the layer (b) adheres to the substrate and exposure is carried out. The exposed part is photoset and the unexposed part is removed by development. <P>COPYRIGHT: (C)2003,JPO |
