发明名称 |
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor structure of the present invention comprises: a plurality of devices individually including a first surface having an active component disposed thereon; and a molding disposed between the devices and including the first surface, wherein one of the devices substantially has a different height from another device of the devices, and the first surface of the molding includes a recess part recessed from one of the first surfaces of the devices. |
申请公布号 |
KR20160104524(A) |
申请公布日期 |
2016.09.05 |
申请号 |
KR20150085375 |
申请日期 |
2015.06.16 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YU CHEN HUA;YEE KUO CHUNG;HUNG JUI PIN |
分类号 |
H01L23/28;H01L23/053;H01L23/525 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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