| 摘要 |
PROBLEM TO BE SOLVED: To prevent dislocation in mounting of a semiconductor element which is mounted on a board for mounting a semiconductor element through thermocompression bonding. SOLUTION: In a semiconductor mounter equipped with a movable stage 3 for moving vertically a placed semiconductor mounting board for mounting a semiconductor, a fixing block 4 for supporting the vicinity of the semiconductor element mounting region of the semiconductor mounting board from under, with its topside serving as a placing face, and a pressure-bonding tool 5 for ascending and descending above the fixing block 4 so as to pressure-bond the semiconductor element, the fixing block 4 is provided with a detection sensor S for detecting the interval H2 between the placing face 4a of this fixing block 4 and a downside L1a of a liquid crystal panel L, and this mounter makes the movable stage 3 move vertically, based on the value of the interval H2. That is, this stops the mobile stage 3 at a position higher than the placing face 4a of the fixing face 4, and it moves vertically by the value of the interval H2. COPYRIGHT: (C)2003,JPO
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