| 摘要 |
PROBLEM TO BE SOLVED: To remove a coating film on an alignment mark of a wafer by using a laser beam without contaminating the wafer. SOLUTION: An apparatus comprises a nozzle 4 for spouting pure water onto a wafer W, a guiding member 5 with a linear groove on its lower face for guiding the pure water from the nozzle 4, and a re-collecting nozzle 25 for sucking and removing the pure water that passes through the guiding member 5. The guiding member 5 is so provided that the groove is located on a film removing position P of the wafer. The guiding member 5 is made of transparent material. The pure water spouted from the nozzle 4 is guided by the guiding member 5, passes the film removing position P on the wafer W and is discharged from the re-collecting nozzle 25. In this state, the film removing position P is irradiated with a laser beam from a laser oscillating device 3 to fragment a coating at the film removing position P. The fragmented pieces of coating is carried away by the flow of the pure water and sucked out by the re-collecting nozzle 25, so that the coating is removed without sticking onto the wafer W. COPYRIGHT: (C)2003,JPO
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