发明名称 PACKAGE COVER FOR HIGH-FREQUENCY CIRCUIT AND PACKAGE FOR THE HIGH-FREQUENCY CIRCUIT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a package cover for a high-frequency circuit which has a resonance suppression capability and a package for a high-frequency using the same. SOLUTION: The package for the high-frequency circuit comprises an electromagnetic wave absorber having a locking section, a cover, and a member for fastening. The electromagnetic wave absorber is secured to the cover by means of the member for fastening inserted and fixed in the locking member. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249582(A) 申请公布日期 2003.09.05
申请号 JP20020048665 申请日期 2002.02.25
申请人 KYOCERA CORP 发明人 NAKAMURA SAEKI
分类号 H05K9/00;H01L23/02;(IPC1-7):H01L23/02 主分类号 H05K9/00
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