| 摘要 |
PROBLEM TO BE SOLVED: To seal a semiconductor by attaining superior heat resistance, water resistance, electrical insulation properties, chemical resistance, and physical strength, and reducing the thickness after sealing. SOLUTION: A sealing tape 3 obtained by having a carrier 32 stuck to a thin resin sheet 31 made of an epoxy resin, is laid over a semiconductor 2 which is mounted on a substrate 1, so that the whole surface of the semiconductor 2 is covered therewith, and that the side of the thin resin sheet 31 faces the surface of the semiconductor 2. The resultant is heated and pressed from the side of the carrier 32 so as to soften the thin resin sheet 31 and thus to give appropriate viscosity and adherence thereto. The thin resin sheet 31, having viscosity and adherence is then bonded to the semiconductor 2 and the substrate 1, thereby sealing the semiconductor 2, while allowing the softened resin to cure, after the completion of the heat treatment. The carrier 32 is separated from the thin resin sheet 31, after completing the heat treatment. COPYRIGHT: (C)2003,JPO
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