发明名称 SYSTEM AND METHOD FOR EVALUATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate-evaluating system and a substrate-evaluating method that can simply and quickly conform the presence or absence of the pattern falling of a resist pattern in development treatment. SOLUTION: When an organic solvent is supplied in a resist pattern having an aspect ratio of 4.0, and pattern falling in a focus value of -0.2 is equal to 10% or less (9.5% in an experiment result), it is considered that no pattern falling is generated even without inspecting a wafer when exposure is made by the best value±0 having more excellent exposure conditions. More specifically, when the pattern falling does not occur or the specific number or less of patterns falling exist when exposure is made under poor conditions as compared with normal conditions, the resist pattern that is exposed under the more excellent conditions can be acknowledged to be no pattern falling even without inspection, and the presence or absence of the pattern falling can be checked simply and quickly. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249441(A) 申请公布日期 2003.09.05
申请号 JP20020358425 申请日期 2002.12.10
申请人 TOKYO ELECTRON LTD 发明人 AOYAMA TORU;IWAKI HIROYUKI
分类号 G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
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