| 摘要 |
PROBLEM TO BE SOLVED: To obtain a blanking die for a semiconductor package, which can reduce chipping and cracks of the body of a semiconductor package, and to obtain a method of manufacturing the package. SOLUTION: The blanking die removes a cull 5 and gates 3 and 4 by means of a cull-punching punch 8 and a gate-punching punch 7, respectively, after molded in the manufacturing process of the semiconductor package 1. The shape of a front end 7b of the cutting end section of the punch 7 is thinned with a prescribed angle with respect to its cutting surface. The punches 8 and 7 have a control means which controls the punches 8 and 7 to simultaneously blank the package 1. COPYRIGHT: (C)2003,JPO
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