| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a joining structure, downsize an electronic component, increase a joining strength, a maintain an original base-material strength of a conductor. SOLUTION: A tin fillet 57 where tin of the upper-most layer of an electrode 31 is melted and solidified, is formed on both sides of a non-press portion 51 of a conductor 29B. The non-press portion 51 is joined as in its original diameter. COPYRIGHT: (C)2003,JPO
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