PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR FORMING PHOTOSENSITIVE ELEMENTS OR RESIST PATTERNS WITH THE SAME, AND PROCESS FOR PRODUCTION OF PRINTED WIRING BOARDS

摘要

A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound bearing in the molecule at least one polymerizable ethylenically unsaturated bond, and (C) a photopolymerization initiator, characterized in that the component (B) consists of (B1) a photopolymerizable compound bearing at least two polymerizable ethylenically unsaturated bonds in the molecule and having a molecular weight of 800 to 3000 and (B2) a photopolymerizable compound bearing one polymerizable ethylenically unsaturated bond in the molecule and that (C1) a coumarin compound and (C2) a 2,4,5-triaryl- imidazole dimer are contained as at least part of the component (C) in a total amount of 80 wt% or above based on the whole weight of the component (C).