发明名称 METHOD FOR BONDING THERMOPLASTIC FOR MANUFACTURING MICROFLUIDIC DEVICE
摘要 Disclosed is a bonding method of a PMMA substrate for manufacturing a microfluidic device. According to an embodiment of the present invention, the bonding method of a PMMA substrate comprises the following steps of: a) arranging a first PMMA substrate having a microchannel, and a flat second PMMA substrate; b) modifying the surface of the first PMMA substrate to impart hydrophobicity to the microchannel, or selectively modifying the surface of the microchannel only; c) treating the surface of the first and second PMMA substrate with ethanol; and d) closely arranging the first and second PMMA substrates, and bonding the resultant product by heat pressing the same. The bonding method can bond a PMMA substrate at a relatively low temperature and pressure, and can manufacture a PMMA bonded substrate having excellent bond strength without altering a channel profile.
申请公布号 KR101656857(B1) 申请公布日期 2016.09.13
申请号 KR20150105686 申请日期 2015.07.27
申请人 GACHON UNIVERSITY OF INDUSTRY-ACADEMIC COOPERATION FOUNDATION;CENTENNIAL TECHNOLOGY COMPANY 发明人 LEE, NAE YOON
分类号 B01L3/00 主分类号 B01L3/00
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