| 摘要 |
<p>A method for partially plating a resin base to form a patterned plating layer on it. The method comprises the steps of oxidizing a resin base, allowing a compound having a structure coordinatable to a metal atom or a metal ion to adhere to the oxidized surface of the resin base in a pattern so as to form a initiator pattern, forming a plating layer on the initiator pattern by electroless plating, and growing, if necessary, the plating layer to a desired thickness. A partially-plated resin base produced by the method, and a method for manufacturing a multilayer circuit board using the partial plating method are also disclosed.</p> |
