| 摘要 |
In a case of a semiconductor chip having an electrode pad to be wire-bonded to a header, securing of a fixing region is difficult since the spread of an Ag paste cannot be controlled, therefore, there has existed a problem such that stable manufacturing could not be carried out. Also, there existed a problem such that realization of stable manufacturing resulted in an excessively large external package form. A projection part is provided in a header, and a fixing region of a bonding wire is secured by arranging a chip at a position shifted in a direction to become distant from the projection part. An electrode pad to be connected to the header is arranged closer to the chip center than the other electrode pads of the identical chip side, and a wire is extended therefrom to the projection part or in the vicinity thereof so as to cross the chip and is fixed. Thereby, downsizing of the package and stable manufacturing are realized.
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