| 摘要 |
A method of manufacturing an integrated circuit IC device is disclosed. A wafer including multiple dies is processed to form cavities along scribe lines that separate the dies. The cavities correspond to connection pads of the dies. Routers are formed to electrically route a connection pad to the interior of its corresponding cavity. Wafer material is then removed from a second side of the wafer, opposite the first side, to expose the routers in the cavities. Contacts are formed on the second side that electrically connect with the routers in the interior of the cavities to thereby electrically connect with the connection pads on the first side. The dies are separated along the scribe lines to produce individualized dies. An IC device including a separated die is also disclosed. |
