METHOD FOR BORING HOLES IN A SUBSTRATE, ESPECIALLY AN ELECTRICAL CIRCUIT SUBSTRATE, BY MEANS OF A LASER BEAM

摘要

When boring holes in an electrical circuit substrate, a laser beam (4) is moved in concentric orbits in the region of the hole to be bored. According to the invention, the transition from one orbit (K1 to K5) to the next is respectively carried out on an arc (b1 to b4) which approximately tangentially moves away from the last orbit passed through, and approximately tangentially adapts to the new orbit to be described, in such a way that the starting point of a new orbit is respectively staggered in relation to the starting point of the previous orbit by a pre-determined angle. The invention enables the energy of the laser beam to be distributed in a uniform manner, and the circular shape of the bored hole is improved.