| 摘要 |
The present invention is intended to provide cured articles which has excellent heat resistance and excellent flexibility, excellent adhesion, excellent dielectric properties and excellent toughness suitable laminates, metal foil-clad laminates, insulating materials for build-up substrates, flexible printed wiring boards, materials for flexible printed wiring boards, etc. The epoxy resin compositions of the present invention are characterized by comprising as essential ingredients an epoxy resin (a), an amine curing agent (b), and a phenolic hydroxyl group-containing polyamide-poly (butadiene-acrylonitrile) block copolymer (c).
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