发明名称 Electro-plating apparatus & method
摘要 Electroplating station S has head 1 with anode 2, to one side of which there is located an electrically-neutral wall 3. A passageway 4 for electrolyte 5 is between anode 2 and wall 3. Guide 7 of wall 3, serrations 9 and mesh 11 enhance and maximise the production of streamwise vortices, to cause substantial increase in the ion flow which overcomes boundary layers and results in additional deposition of copper onto the web.
申请公布号 US2003164301(A1) 申请公布日期 2003.09.04
申请号 US20020318779 申请日期 2002.12.13
申请人 LOWE JOHN MICHAEL 发明人 LOWE JOHN MICHAEL
分类号 C25D5/02;C25D5/08;C25D7/12;C25D17/00;(IPC1-7):C25D5/00 主分类号 C25D5/02
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