| 摘要 |
A stencil apparatus includes an elongated stencil support strip having at least one longitudinally extending severance line, and at least one stencil support area between the severance line and an edge of the stencil support strip. Stencil elements with pressure sensitive adhesive on their lower surfaces are releasably mounted on the stencil support areas and arrangements are provided for removal of material underlying the stencil elements, thereby exposing cutouts through the stencil elements for transferring marking material onto a target surface. The stencil apparatus may be formed of either one or two layers and may have upper and lower stencil support areas and upper and lower masking strips. |
