| 发明名称 |
Wafer processing apparatus and a wafer stage and a wafer processing method |
| 摘要 |
A wafer processing apparatus comprising a wafer stage, wherein a semiconductor wafer is mounted on the wafer stage so as to process the semiconductor wafer, wherein a holding mechanism of the wafer stage is commonly used for a plurality of wafer stages, and accordingly, the wafer stage can be changed into a wafer stage having a different function so as to process the semiconductor wafer.
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| 申请公布号 |
US2003164226(A1) |
申请公布日期 |
2003.09.04 |
| 申请号 |
US20020086722 |
申请日期 |
2002.03.04 |
| 申请人 |
KANNO SEIICHIRO;KAWAHARA HIRONOBU;SUEHIRO MITSURU;KANAI SABUROU;MASUDA TOSHIO |
发明人 |
KANNO SEIICHIRO;KAWAHARA HIRONOBU;SUEHIRO MITSURU;KANAI SABUROU;MASUDA TOSHIO |
| 分类号 |
B44C1/22;C03C15/00;C03C25/68;C23C16/00;C23F1/00;H01L21/00;H01L21/302;H01L21/306;H01L21/3065;H01L21/66;(IPC1-7):C23C16/00 |
主分类号 |
B44C1/22 |
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