| 摘要 |
<p>A photosensitive resin composition containing an alkali-soluble resin, a photosensitive agent having a quinonediazide moiety, a specific phenolic compound and a solvent and optionally a curing agent having an epoxy group, characterized in that the alkali-soluble resin is an acrylic resin, and the solvent is a mixture of propylene glycol monomethyl ether acetate with a solvent which has a vapor pressure at an ordinary temperature under an ordinary pressure less than that of propylene glycol monomethyl ether acetate (for example, ethyl 2-hydroxypropionate). The photosensitive resin composition exhibits good applicability and also is free from problems associated with development residues, and thus can be suitably used for forming an interlayer insulating film, a flattening film, or the like for a semiconductor device, FPD, or the like.</p> |
