| 摘要 |
<p>A method and apparatus for building a memory module using improved patching schemes comprises, mounting multiple primary and secondary memory parts on a mufti-layer circuit board (111), positioning I/O bit line patching networks adjacent to the primary and secondary memory parts (112), matching read/write control signals for primary and secondary memory parts which share I/O bit line patching networks (113), testing primary and secondary memory parts to identify non-operable I/O lines (114), and patching any non-operable I/O line of a primary memory part by replacing it with a fully operable I/O line of its associated backup memory part (115). The method and apparatus include mufti-layer circuit boards which utilize 2-to 1, 4-to-1, and 8-to-1 patching configurations.</p> |
