HEATING DEVICE FOR MANUFACTURING SEMICONDUCTOR

摘要

A heating device for manufacturing a semiconductor capable of uniformly heating a processed material such as a wafer and specifically used for heat-curing resin film for photolithography in coater developers and heat-baking insulation film with low dielectric constants, comprising a holding body (1) of ceramics having a resistance heating element (2) buried therein and holding and heating the processed material such as the wafer (6), a tubular support member (4) for supporting the holding body (1) of ceramics, and a chamber (5) for storing the holding body (1) and the support member (4), wherein atmospheres in the tubular support member (4) and the chamber (5) are maintained substantially identical to each other by eliminating the air-tight sealing of the support member (4) by the holding body (1) ceramics or by controlling the introduction and discharge of gas.