| 摘要 |
Curable compositions comprise a benzoxazine compound or resin in combination with at least one additional curable compound or resin. Optionally, the composition will further comprise a curing agent and/or a filler. These compositions have utility as adhesives, coatings and encapsulants, especially for use within the semiconductor fabrication industry, with particular utility as die attach adhesives, films, and underfill materials, such as no-flow underfills, capillary flow underfills, wafer level underfills, and as lead free solders.
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