| 发明名称 |
Semiconductor module including a plurality of semiconductor devices detachably |
| 摘要 |
A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
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| 申请公布号 |
US2003164544(A1) |
申请公布日期 |
2003.09.04 |
| 申请号 |
US20020214306 |
申请日期 |
2002.08.08 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SATO MITSUTAKA;FUJISAWA TETSUYA;MARUYAMA SHIGEYUKI;KASAI JUNICHI;KAWAHARA TOSHIMI;HAMANO TOSHIO;KUBOTA YOSHIHIRO;OSAWA MITSUNADA;YONEDA YOSHIYUKI;TSUJI KAZUTO;MATSUKI HIROHISA |
| 分类号 |
H01L23/32;H01L25/00;H01L25/10;H05K7/14;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/32 |
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