| 摘要 |
<p>A heat treatment device (100) and a heat treatment method, the device comprising a susceptor (2) rotatably installed in a heat treating container (1) for placing a wafer (W) thereon, a preheat ring (3) supported on a pedestal (4) installed in the heat treating container (1) and surrounding the periphery of the susceptor (2) in proximity to each other and in the state of non-contact with each other, and a heating device (8) for heating the wafer (W) placed on the susceptor (2); the method comprising the steps of forming the preheat ring (3) so that the inner peripheral center (31a) thereof is eccentric to the outer periphery (32) thereof, moving the preheat ring (3) around the susceptor (2) to position the preheat ring (3) so that a distance between the inner peripheral center (31a) of the preheat ring (3) and the center (2b) of the susceptor (2) becomes minimum, and applying a heat treatment to the wafer (W).</p> |
