发明名称 Installation device
摘要 A mounting apparatus for bonding objects to each other, comprising a cleaning part (3) for cleaning at least the bonding surfaces of first objects (2a, 2b) and a bonding part (4) for bonding the cleaned first objects (2a, 2b) to a second object (2c), wherein both parts are connected to each other so that the objects can be conveyed between both parts, and an inverting mechanism (17) for turning over the first objects (2a, 2b) without touching the cleaned bonding surfaces is provided in the bonding part, whereby the cleaning of the bonding surfaces can be carried out efficiently, and a total time for a series of operations ranging from the cleaning to the completion of bonding can be shortened remarkably.
申请公布号 US2003164394(A1) 申请公布日期 2003.09.04
申请号 US20030344939 申请日期 2003.02.19
申请人 SUGA TADATOMO;YAMAGUCHI AKIRO 发明人 SUGA TADATOMO;YAMAGUCHI AKIRO
分类号 H05K3/34;B23K1/20;H01L21/00;H01L21/60;(IPC1-7):B23K37/00 主分类号 H05K3/34
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