| 摘要 |
PURPOSE: A method for manufacturing a CSP(Chip Scale Package) is provided to be capable of shorten the connection time between a signal transmission board and an outer lead. CONSTITUTION: A tap tape is prepared. The tap tape includes a semiconductor chip(12) with bonding pads(12a), an ACF(Anisotropic Conductive Film) tape(16) with a conductive particle(24) and a laminating(25) and an LOC(Lead On Chip) tape, and a plurality of first conductive pads(16a) located at back-side of the ACF tape. The ACF tapes(16) of the tap tape are attached with the bonding pads(12a) of the semiconductor chip. The first conductive pads(16a) are pressed to a desired pressure.
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