发明名称 |
METHOD OF PRODUCING HEAT SINK PACKAGE BY ROTATING JIG TYPE PLASMA THERMAL SPRAY |
摘要 |
PURPOSE: A method of producing heat sink package by rotating jig type plasma thermal spray is provided to efficiently and economically fabricate a heat sink substrate adaptable to an IC package of a hermetic 4 sided seal type by performing a plasma spraying process using alumina powder. CONSTITUTION: Oxygen free high-conductive copper(OFHC) as a raw material and coating powder are prepared. A grit blasting(G/B) process is performed. The surface of copper is plated. A black oxide process is carried out. A spraying process is performed.
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申请公布号 |
KR20030071418(A) |
申请公布日期 |
2003.09.03 |
申请号 |
KR20020011105 |
申请日期 |
2002.02.28 |
申请人 |
SEWON HARD FACING CO;UR, SOON CHUL |
发明人 |
KIM, IL HO;LEE, JEONG IL;LEE, YEONG GEUN;UR, SOON CHUL |
分类号 |
H01L23/36;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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地址 |
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