| 摘要 |
PURPOSE: An apparatus for planarizing a semiconductor wafer is provided to make a difference of a removal rate in a wafer uniform by planarizing a metal layer and an insulation layer in a multilayered interconnection process through a mechanical cutting method. CONSTITUTION: A semiconductor wafer(100) is placed on the first bedplate(110) so that the height of the semiconductor wafer is controlled. The first bedplate is positioned by a pad(120). A rotation axis(130) rotates the pad. A cutting apparatus(140) cuts the semiconductor wafer. A height control part(151) controls the height of the cutting apparatus. A right-and-left control part(152) transfers the cutting apparatus in the right and left direction. The second bedplate(150) is composed of the height control part and the right-and-left control part.
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