发明名称 |
Semiconductor device and method for fabricating the same |
摘要 |
A group of wires (22) bonding a first semiconductor chip and a second semiconductor chip together extends on the first semiconductor chip and is formed of a film layer (121, 122) (for example through plating) in one continuous process. The second semiconductor chip is then bonded onto the first semiconductor chip to complete a semiconductor package. <IMAGE> <IMAGE> |
申请公布号 |
EP1341232(A2) |
申请公布日期 |
2003.09.03 |
申请号 |
EP20020255356 |
申请日期 |
2002.07.31 |
申请人 |
FUJITSU LIMITED |
发明人 |
IKUMO, MASAMITSU;MATSUKI, HIROHISA |
分类号 |
H01L25/18;H01L25/065;H01L25/07 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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