| 摘要 |
PURPOSE: A method for fabricating a superconducting Josephson junction device is provided to improve reliability and repeatability by eliminating a problem arising from an ultra thin Josephson junction device having a thickness of several angstrom. CONSTITUTION: A superconducting thin film(11) and the first silicon layer(12) are sequentially formed and patterned on a substrate(10). An oxide layer is formed in an extremely small part of the first silicon layer. The second silicon layer(14) is formed on the entire surface including the oxide layer. A part of the second silicon layer is eliminated to expose the oxide layer. The oxide layer is etched. Ions are implanted into the silicon layer to form an interface of the superconducting thin film.
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