发明名称 Apparatus for washing substrate
摘要 A substrate washing apparatus comprising a spin chuck (21) configured to hold a substrate W so as to freely rotate the substrate W, such that a surface of the substrate W to be washed is a top surface thereof; a scrubbing member (33, 51, 54, 61, 73) configured to abut on the substrate W on the spin chuck (21) and scrub the surface W; washing liquid supply means (92, 93) for supplying a washing liquid to the substrate W on the spin chuck (21) via the scrubbing member (33, 51, 54, 61, 73); a waiting section (24, 24A) configured to cause the scrubbing member (33, 51, 54, 61, 73) to stand by when the scrubbing member (33, 51, 54, 61, 73) is not used for the substrate W on the spin chuck (21); and moving means (41) for moving the scrubbing member (33, 51, 54, 61, 73) between the waiting section (24, 24A) and the spin chuck (21); the scrubbing member (33, 51, 54, 61 73) characterized by comprising; an abutting portion (33a, 51, 54a, 61a, 73a) formed of a sponge (73) allowing the liquid to permeate therethrough; and a non-contact peripheral portion (33b, 54b, 73b) provided about the abutting portion (33a, 54a, 73a) and formed not to contact the surface to be washed when the abutting portion (33a, 54a, 73a) is in contact with the surface to be washed. <IMAGE>
申请公布号 EP1341212(A2) 申请公布日期 2003.09.03
申请号 EP20030011900 申请日期 1997.11.12
申请人 TOKYO ELECTRON LIMITED 发明人 TANAKA, HIDEYA;MIYAMOTO, KENICHI;KUBOTA, MINORU;SWANSON, WALTER
分类号 B08B1/04;H01L21/00;(IPC1-7):H01L21/00 主分类号 B08B1/04
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