Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate

摘要

A semiconductor device wherein a circuit substrate of a single or multiple layer is composed in such a manner that bumps (22), which are electrically connected to connection electrodes (12) provided on one face of a surface mount device (10), are arranged in the same planar arrangement as that of the connection electrodes (12). The bumps (22) protrude from one side of a sheet of metal foil (20) on which wiring patterns (16) electrically connected to the bumps (22) are formed. An insulating adhesive agent layer (18) is adhered to the side of the sheet of metal foil (20) having the bumps (22) and is also adhered to one face of the surface mount device (10) while the tips of the bumps (22) come into contact with respective connection electrodes (12).