发明名称 ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 An electronic product comprises a heat radiating plate (12), an electronic component (14) securely mounted on the heat radiating plate and including a high power transistor, an enveloper (18) including a frame member (19) securely associated with the heat radiating plate to encompass the electronic component, and a lid member (20, 50) securely attached to an upper opening end of the frame member, thereby accommodating and sealing the electronic component in the enveloper, and at least one electrically conductive element (23, 24) passing and extending through the frame member. The frame member is made of a suitable resin material, and the lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material. <IMAGE>
申请公布号 KR20030071570(A) 申请公布日期 2003.09.03
申请号 KR20030012481 申请日期 2003.02.27
申请人 发明人
分类号 H01L23/34;H05K7/20;H01L21/56;H01L23/02;H01L23/047;H01L23/08;H01L23/36;H01L23/433;H01L23/48;H01L23/552 主分类号 H01L23/34
代理机构 代理人
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