| 发明名称 |
High frequency circuit board and method of producing the same |
| 摘要 |
<p>A high frequency circuit board free from variations in transmission impedance and having the desired characteristics is produced. A surface of a resin substrate (21) is activated to form a roughened surface, and a thin-wall pattern of an electrically conductive metal (23) is formed directly on the roughened surface of the resin substrate. <IMAGE></p> |
| 申请公布号 |
EP1133217(A3) |
申请公布日期 |
2003.09.03 |
| 申请号 |
EP20010302040 |
申请日期 |
2001.03.06 |
| 申请人 |
STANLEY ELECTRIC CO., LTD.;MEITO DENSAN CO., LTD. |
发明人 |
KANECHIKA, MASAYUKI;URABE, HIDEKI;KURIYAMA, YOSHIO |
| 分类号 |
H05K3/06;H01P3/08;H01P11/00;H05K1/02;H05K3/14;H05K3/38;H05K3/42;(IPC1-7):H05K1/02 |
主分类号 |
H05K3/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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