| 发明名称 |
METHOD FOR PRODUCTION OF A SUPPORT ELEMENT FOR AN IC COMPONENT |
| 摘要 |
A method for production of a support element for an IC component for installation in data support cards is disclosed, whereby holes punched through the support element are provided with a conducting boundary region arranged on one side thereof and in a further process step are filled with a setting conducting paste. |
| 申请公布号 |
EP1340259(A1) |
申请公布日期 |
2003.09.03 |
| 申请号 |
EP20010962609 |
申请日期 |
2001.08.13 |
| 申请人 |
ORGA KARTENSYSTEME GMBH |
发明人 |
SENGE, CARSTEN;MENTZER, RUEDIGER;OSTERWALD, FRANK |
| 分类号 |
G06K19/077;H01L23/498 |
主分类号 |
G06K19/077 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
