| 摘要 |
PURPOSE: A heat sink system is provided to elastically be closely adhered to a chipset by a spring installed at a fixture hole for absorbing a vibration or a shock so that it can prevent a damage of the chipset. CONSTITUTION: The system comprises a heat sink(74) and a fixture device. The heat sink(74) discharges a heat generated at a chipset by being adhered to an upper face of the chipset. The heat sink(74) includes a pair of guide grooves(52) at one end which is not adhered to the chipset. The fixture device, whose rear end is inserted into a hole formed at a circuit board, pushes the heat sink toward the upper face of the chipset. The fixture device includes a plate type rod(56), a fixture pin(66), and a spring(68). The spring(68) winds around a fixing pin(66), and elastically pushes a head(71) of the fixing pin(66) while it is being supported by the plate type rod(56). |
