MOUNT TOOL AND MOUNT STAGE OF SEMICONDUCTOR DIE BONDING EQUIPMENT

摘要

PURPOSE: A mount tool of semiconductor die bonding equipment is provided to improve work efficiency of a die bonding process regardless of the type of a device. CONSTITUTION: A junction surface(52) has a surface for pressing a predetermined object by using external force. A body(56) supports the junction surface. A fixing unit protrudes from the periphery of the body. A fixing unit has a hole to be fixed to a driving unit for supplying external force, capable of rotating.