| 发明名称 |
POWER-GROUND PLANE PARTITIONING AND VIA CONNECTION TO UTILIZE CHANNEL/TRENCHES FOR POWER DELIVERY |
| 摘要 |
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes. |
| 申请公布号 |
AU2003207694(A1) |
申请公布日期 |
2003.09.02 |
| 申请号 |
AU20030207694 |
申请日期 |
2003.01.23 |
| 申请人 |
INTEL CORPORATION |
发明人 |
GARY BRIST;GARY LONG;DARYL SATO |
| 分类号 |
H05K1/02;H05K3/46;(IPC1-7):H05K1/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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