COVER TAPE FOR TAPING PACKAGING FOR ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a cover tape for a taping package having a stable heat sealing property for a carrier tape and a superior fastening-up property and satisfying all the functions such as a conductive property and transparency. SOLUTION: A base material film layer, a soft material layer and a thermal adhering layer are laminated in sequence. The soft material layer is made of a linear low density polyethylene. The thermal adhering layer includes a thermoplastic resin and conductive fine particles. An amount of inclusion of the conductive fine particles in the thermal adhering layer shows a mass rate of 150 to 500 of conductive fine particles against 100 of thermoplastic resin at the thermal adhering layer. The thickness of the soft material layer is 10 to 50μm. The thickness of the thermal adhering layer is 0.05 to 1.9μm. COPYRIGHT: (C)2003,JPO