发明名称 Electrostatic discharge-protection semiconductor device
摘要 The present invention provides an electrostatic discharge-protection device located between a pad and a specific voltage point. The electrostatic discharge-protection device has a P-type substrate. Then a first N-type well, a first P-type doped region, and a first N-type doped region, are formed on the P-type substrate, wherein the first P-type doped region and the first N-type doped region are coupled to the specific voltage point, respectively. A second P-type doped region and a second N-type doped region are formed on the first N-type well and are coupled to the pad, respectively. Moreover, a third N-type doped region and a fourth N-type doped region are formed on the P-type substrate. The third N-type doped region is coupled to the pad, and a second N-type well is formed between the third N-type doped region and the fourth N-type doped region.
申请公布号 US6614061(B2) 申请公布日期 2003.09.02
申请号 US20010782719 申请日期 2001.02.13
申请人 WINDBOND ELECTRONICS CORP. 发明人 MIAW JIUNN-WAY
分类号 H01L21/4763;H01L23/60;H01L23/62;H01L27/02;H01L31/111;(IPC1-7):H01L31/111 主分类号 H01L21/4763
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