发明名称 |
Method for registering a component lead with a U-shaped metalized pad |
摘要 |
A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.
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申请公布号 |
US6612023(B1) |
申请公布日期 |
2003.09.02 |
申请号 |
US19960709354 |
申请日期 |
1996.09.06 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
LICHTENWALTER GUY;MARSCHKE NORMAN D. |
分类号 |
H01R43/02;H05K1/11;H05K3/34;H05K13/00;H05K13/04;(IPC1-7):H05K3/32 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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