发明名称 |
Manufacturing method for ink jet pen |
摘要 |
The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.
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申请公布号 |
US6612032(B1) |
申请公布日期 |
2003.09.02 |
申请号 |
US20000495168 |
申请日期 |
2000.01.31 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
MURTHY ASHOK;CORLEY, JR. RICHARD EARL;REEVES KRIS ANN;SINGH JEANNE MARIE SALDANHA;SPIVEY PAUL TIMOTHY |
分类号 |
B41J2/14;B41J2/16;(IPC1-7):B21D53/76;B23P17/00 |
主分类号 |
B41J2/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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