发明名称 |
Approach for forming a buried stack capacitor structure featuring reduced polysilicon stringers |
摘要 |
A process for forming a buried stack capacitor structure in a recessed region of a shallow trench isolation (STI) region, has been developed. The process features a unique sequence of procedures eliminating possible polysilicon stringers or residuals which if left remaining would result in leakage or shorts between conductive elements. The unique sequence of procedures include: deposition of a silicon oxide layer on the polysilicon layer from which the storage node structure will be defined from; photoresist plugs used to protect the portions of the silicon oxide and the underlying polysilicon layer located in the recessed region, during definition of the polysilicon storage node structure; and definition of the polysilicon storage node structure via a wet etch procedure, using the silicon oxide layer for protection of the underlying polysilicon storage node structure.
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申请公布号 |
US6613690(B1) |
申请公布日期 |
2003.09.02 |
申请号 |
US20020197318 |
申请日期 |
2002.07.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
CHANG CHUNG-WEI;TZENG KUO-CHYUAN;WANG CHEN-JONG;CHIANG MIN-HSIANG;LO CHI-HSING |
分类号 |
H01L21/02;H01L21/3213;H01L21/8242;H01L27/108;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/02 |
代理机构 |
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