发明名称 PROCESSING METHOD FOR MOLD FOR MOLDING LIGHT GUIDE PLATE, DIE AND LIGHT-GUIDE PLATE
摘要 <P>PROBLEM TO BE SOLVED: To efficiently increase the light transmission properties in a light-guide plate 2 equipped with reflecting dots 1. <P>SOLUTION: First, a resist film non-forming section 11 for a silicon base material 6 is dry-etched 23 by a specified depth 24, and a resist film-forming section is removed. Thus, a master 13 for preparing a mold equipped with a dot-form pattern having the specified height 24 is formed. Then, a nickel- electroforming is applied to the master 13, and the master 13 is melt-removed. Thus, the electroforming mold 15 can be obtained as a split mold 5 equipped with a reflecting dot-form surface 4. At the same time, the light-guide plate 2 (molded article) equipped with the dot-form pattern is molded by this light- guide plate-mold 3 equipped with the split die 5 having the dot-form pattern. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003245925(A) 申请公布日期 2003.09.02
申请号 JP20020049594 申请日期 2002.02.26
申请人 TOWA CORP 发明人 OSADA MICHIO;MATSUO MAKOTO;AZUMA DAISUKE
分类号 G02B6/00;B29C33/38;G02F1/13357 主分类号 G02B6/00
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