发明名称 Memory module having series-connected printed circuit boards
摘要 A memory module having series-connected printed circuit boards is provided. The memory module comprises a plurality of printed circuit boards, each comprising a plurality of memory chips mounted thereon, and signal lines and connection means for electrically connecting the printed circuit boards to one another. The connection means electrically series-connects the signal lines of each of the printed circuit boards. Preferably, an end termination circuit is formed on a terminal of the signal line of the farthest printed circuit board from a connector of a mother board, and the memory chip performs at a speed of approximately 150~300 MHz. The connection means is a flexible jumper assembly having a flexible film and a jumper line formed on the flexible film. Each of the printed circuit boards further comprises a jumper pad connected with the signal lines. The flexible jumper assembly interconnects the jumper pads of each of the printed circuit boards to one another. Among a plurality of the printed circuit boards, conductive leads are formed on an edge of one of the printed circuit boards. The conductive leads serve to connect the circuit boards with the connection means. The printed circuit board comprising the conductive leads is disposed on the first or the final of a plurality of the printed circuit boards. The jumper pads of each of the printed circuit boards are disposed opposite to the corresponding jumper pads of the other printed circuit boards.
申请公布号 US6614664(B2) 申请公布日期 2003.09.02
申请号 US20010924758 申请日期 2001.08.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE DONG YANG
分类号 G11C15/00;H05K1/14;(IPC1-7):H05K1/00;H01R12/16;H05K1/11 主分类号 G11C15/00
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