Semiconductor chip configuration and method of controlling a semiconductor chip

摘要

An integrated semiconductor chip is connected to external terminals with all of its data-carrying bonding pads. One of a plurality of possible data input/data output organizational forms is preset for a normal mode. Not all of the data-carrying bonding pads are used for the normal mode. During a test mode all of the data-carrying bonding pads are used. Thus, irrespective of the preset data input/data output organizational form, a uniform test mode requiring a minimal expenditure of time is possible. A method for controlling a semiconductor chip is also provided.