发明名称 |
Methods for reduced trench isolation step height |
摘要 |
Shallow trench isolation techniques are disclosed in which a thin nitride layer is formed on a semiconductor substrate, and a trench is formed through the nitride layer and into the semiconductor substrate, which is then filled. The wafer is then planarized using a fixed-abrasive CMP process to mitigate or avoid step height in the shallow trench isolation process. The nitride layer is then removed following planarization.
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申请公布号 |
US6613646(B1) |
申请公布日期 |
2003.09.02 |
申请号 |
US20020106005 |
申请日期 |
2002.03.25 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SAHOTA KASHMIR;ACHUTHAN KRISHNASHREE |
分类号 |
H01L21/3105;H01L21/762;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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