发明名称 Electronic circuit device and hybrid integrated circuit with an ASIC and an FPGA
摘要 A hybrid integrated circuit in which the specification can quickly be modified and adjusted without preparing a new mask and without compromising the performance of the hybrid integrated circuit. The hybrid integrated circuit includes a common substrate on which an electrode pattern is formed; a first monolithic semiconductor chip designed as an ASIC; and a second monolithic semiconductor chip designed as an FPGA. The second monolithic semiconductor chip includes a storage element which is rewritable by a control signal through an external terminal to store circuit configuration data with which internal connections of the second monolithic semiconductor chip are modified to form a hardware configuration within the second monolithic semiconductor chip corresponding to a predetermined operational specification, and in which the first monolithic semiconductor chip and the second monolithic semiconductor chip cooperate with each other by exchanging signals through the electrode pattern of the common substrate to implement the predetermined operational specification.
申请公布号 US6614267(B2) 申请公布日期 2003.09.02
申请号 US20010997005 申请日期 2001.11.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TAGUCHI HIDEKI
分类号 H01L25/18;(IPC1-7):H03K19/00;H01L25/00 主分类号 H01L25/18
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