| 摘要 |
PROBLEM TO BE SOLVED: To materialize a highly, reliable BGA(ball grid array)-type semiconductor device, by suppressing disconnection of conductive wiring and the breakage of an external terminal. SOLUTION: Individual insulating films 3 which cover individual lands 2b are separated from one another, and besides dummy wiring 10 is projected, in addition to conductive wiring 2 connected to the land 2b, from the flank 3b of the insulating film 3 covering the land 2b. Hereby, the rate of occupation of the wiring material large in rigidity inside the insulating film 3 can be enlarged, and the restriction of thermal transformation of the insulating film 3 itself can be reinforced by the dummy wiring 10. Moreover, the peeling of the flank 3b of the insulating film can be suppressed by the conductive wiring 2 and the dummy wiring 10, and the increase of the quantity of thermal transformation of the insulating film 3 by the occurrence of the peeling of the flank 3b can be suppressed. |
